DRAM Chip

IS42S16320F-6TL

DRAM Chip SDRAM 512Mbit 32Mx16 3.3V 54-Pin TSOP-II

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  LTB

• HTS

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  SDRAM

• Chip Density (bit)

  512M

• Organization

  32Mx16

• Number of Internal Banks

  4

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  167

• Maximum Access Time (ns)

  6|5.4

• Address Bus Width (bit)

  15

• Process Technology

  63nm

• Interface Type

  LVTTL

• Minimum Operating Supply Voltage (V)

  3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  180

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  70

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  1

• Package Width

  10.16

• Package Length

  22.22

• PCB changed

  54

• Standard Package Name

  SO

• Supplier Package

  TSOP-II

• Pin Count

  54