Flash

IS25WP128-RHLE

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 128M-bit 16M x 8 8ns 24-Pin TFBGA Automotive AEC-Q100

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  Yes

• PPAP

  Yes

• Cell Type

  NOR

• Chip Density (bit)

  128M

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Location of Boot Block

  Bottom|Top

• Address Width (bit)

  24

• Sector Size

  4Kbyte x 4096

• Page Size

  256byte

• Number of Bits/Word (bit)

  8

• Number of Words

  16M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  8

• Maximum Erase Time (s)

  90/Chip

• Maximum Programming Time (ms)

  0.8/Page

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Maximum Operating Frequency (MHz)

  133

• Minimum Operating Supply Voltage (V)

  1.65

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  1.95

• Programming Voltage (V)

  1.65 to 1.95

• Operating Current (mA)

  13

• Program Current (mA)

  30

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Extended

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Mounting

  Surface Mount

• Package Height

  0.84(Max) mm

• Package Width

  6 mm

• Package Length

  8 mm

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  24

• Lead Shape

  Ball