Flash

IS22TF64G-JCLA2

NAND Flash Serial e-MMC 3.3V 512G-bit 512G/128G/64G x 1/4-bit/8-bit 13.7ns 153-Pin VFBGA Automotive AEC-Q100

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  Yes

• PPAP

  Yes

• Cell Type

  NAND

• Chip Density (bit)

  512G

• Architecture

  Sectored

• Boot Block

  Yes

• Address Width (bit)

  32

• Number of Bits/Word (bit)

  1/4/8

• Number of Words

  512G/128G/64G

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  13.7

• Interface Type

  Serial e-MMC

• Minimum Operating Supply Voltage (V)

  2.7

• Maximum Operating Frequency (MHz)

  200

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  90

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  No

• Mounting

  Surface Mount

• Package Height

  1(Max) - 0.15(Min)

• Package Width

  11.5

• Package Length

  13

• PCB changed

  153

• Standard Package Name

  BGA

• Supplier Package

  VFBGA

• Pin Count

  153