Product Technical Specifications
EU RoHS
Compliant with Exemption
ECCN (US)
EAR99
Part Status
Obsolete
HTS
IRLU3636PBF
SVHC
Yes
SVHC Exceeds Threshold
Yes
Automotive
No
PPAP
No
Category
Power MOSFET
Material
Si
Configuration
Single
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
1
Maximum Drain-Source Voltage (V)
60
Maximum Gate-Source Voltage (V)
±16
Maximum Gate Threshold Voltage (V)
2.5
Operating Junction Temperature (°C)
-55 to 175
Maximum Continuous Drain Current (A)
99
Maximum Gate-Source Leakage Current (nA)
100
Maximum IDSS (uA)
20
Maximum Drain-Source Resistance (mOhm)
6.8@10V
Typical Gate Charge @ Vgs (nC)
33@4.5V
Typical Gate to Drain Charge (nC)
15
Typical Gate to Source Charge (nC)
11
Typical Reverse Recovery Charge (nC)
31
Typical Input Capacitance @ Vds (pF)
3779@50V
Typical Reverse Transfer Capacitance @ Vds (pF)
163@50V
Minimum Gate Threshold Voltage (V)
1
Typical Output Capacitance (pF)
332
Maximum Power Dissipation (mW)
143000
Typical Fall Time (ns)
96
Typical Rise Time (ns)
216
Typical Turn-Off Delay Time (ns)
43
Typical Turn-On Delay Time (ns)
45
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
175
Packaging
Tube
Typical Drain-Source Resistance @ 25°C (mOhm)
6.6@4.5V|5.4@10V
Maximum Pulsed Drain Current @ TC=25°C (A)
396
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
50
Typical Gate Plateau Voltage (V)
3.4
Typical Reverse Recovery Time (ns)
27
Maximum Diode Forward Voltage (V)
1.3
Maximum Positive Gate-Source Voltage (V)
16
Mounting
Through Hole
Package Height
6.22(Max)
Package Width
2.39(Max)
Package Length
6.73(Max)
PCB changed
3
Tab
Tab
Standard Package Name
TO
Supplier Package
IPAK
Pin Count
3