Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8541.29.00.55
Automotive
No
PPAP
No
Category
Power MOSFET
Configuration
Single
Process Technology
0.3um
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
1
Maximum Drain-Source Voltage (V)
100
Maximum Gate-Source Voltage (V)
±20
Maximum Gate Threshold Voltage (V)
4
Operating Junction Temperature (°C)
-55 to 150
Maximum Continuous Drain Current (A)
7.7
Maximum Gate-Source Leakage Current (nA)
100
Maximum IDSS (uA)
25
Maximum Drain-Source Resistance (mOhm)
270@10V
Typical Gate Charge @ Vgs (nC)
16(Max)@10V
Typical Gate Charge @ 10V (nC)
16(Max)
Typical Gate to Drain Charge (nC)
7.7(Max)
Typical Gate to Source Charge (nC)
4.4(Max)
Typical Reverse Recovery Charge (nC)
650
Typical Input Capacitance @ Vds (pF)
360@25V
Typical Reverse Transfer Capacitance @ Vds (pF)
34@25V
Minimum Gate Threshold Voltage (V)
2
Typical Output Capacitance (pF)
150
Maximum Power Dissipation (mW)
2500
Typical Fall Time (ns)
17
Typical Rise Time (ns)
27
Typical Turn-Off Delay Time (ns)
18
Typical Turn-On Delay Time (ns)
6.8
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Packaging
Tape and Reel
Maximum Power Dissipation on PCB @ TC=25°C (W)
2.5
Maximum Pulsed Drain Current @ TC=25°C (A)
31
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
50
Typical Gate Plateau Voltage (V)
7.2
Typical Reverse Recovery Time (ns)
130
Maximum Diode Forward Voltage (V)
2.5
Minimum Gate Resistance (Ohm)
1
Maximum Gate Resistance (Ohm)
5
Maximum Positive Gate-Source Voltage (V)
20
Mounting
Surface Mount
Package Height
2.39(Max)
Package Width
6.22(Max)
Package Length
6.73(Max)
PCB changed
2
Tab
Tab
Standard Package Name
TO
Supplier Package
DPAK
Pin Count
3