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IMBG40R011M2HXTMA1|INFINEON|simage
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MOSFETs

IMBG40R011M2HXTMA1

Trans MOSFET N-CH SiC 400V 13.4A 8-Pin(7+Tab) D2PAK T/R

Infineon Technologies AG
Datasheets 

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Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8541.29.00.55
  • Automotive
    No
  • PPAP
    No
  • Category
    Power MOSFET
  • Material
    SiC
  • Configuration
    Single Hex Source
  • Channel Mode
    Enhancement
  • Channel Type
    N
  • Number of Elements per Chip
    1
  • Maximum Drain-Source Voltage (V)
    400
  • Maximum Gate-Source Voltage (V)
    23
  • Operating Junction Temperature (°C)
    -55 to 175
  • Maximum Continuous Drain Current (A)
    13.4
  • Maximum Drain-Source Resistance (mOhm)
    14.4@18V
  • Typical Gate Charge @ Vgs (nC)
    85@18V
  • Typical Input Capacitance @ Vds (pF)
    2900@200V
  • Maximum Power Dissipation (mW)
    3800
  • Typical Fall Time (ns)
    9.3
  • Typical Rise Time (ns)
    18.3
  • Typical Turn-Off Delay Time (ns)
    29.8
  • Typical Turn-On Delay Time (ns)
    15.8
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    175
  • Mounting
    Surface Mount
  • Package Height
    4.4
  • Package Width
    9.25
  • Package Length
    10
  • PCB changed
    7
  • Tab
    Tab
  • Standard Package Name
    TO
  • Supplier Package
    D2PAK
  • Pin Count
    8
  • Family/Series
    IMBG40R011M2HXTMA1
  • ROHS Version
    2011/65/EU, 2015/863
  • Quantity Packaging
    1000
  • MSL
    1
Order Quantity

Documentation and Resources

Datasheets
Design resources