Heat Sinks

ICK S 36 X 36 X 20

Heat Sink Passive Processor Pin Array Adhesive Aluminum 3.2°C/W

Fischer Elektronik GmbH & Co. KG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• Automotive

  No

• PPAP

  No

• Type

  Passive

• Material

  Aluminum

• Thermal Resistance

  3.2(Max)

• Fin Style

  Pin Array

• Device Cooled

  Processor

• Attachment Method

  Adhesive

• Mounting

  Adhesive

• Product Length (mm)

  36.4

• Product Depth (mm)

  36.4

• Product Height (mm)

  20