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FGA25N120ANTDTU|ONSEMI|simage
FGA25N120ANTDTU|ONSEMI|limage
IGBT Chip

FGA25N120ANTDTU

Trans IGBT Chip N-CH 1200V 50A 312W 3-Pin(3+Tab) TO-3PN Rail

onsemi
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • Part Status
    Obsolete
  • HTS
    8541290095
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Channel Type
    N
  • Configuration
    Single
  • Maximum Gate Emitter Voltage (V)
    ±20
  • Maximum Collector-Emitter Voltage (V)
    1200
  • Typical Collector-Emitter Saturation Voltage (V)
    2.65
  • Maximum Continuous DC Collector Current (A)
    50
  • Maximum Gate Emitter Leakage Current (uA)
    0.25
  • Maximum Power Dissipation (mW)
    312
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Packaging
    Rail
  • Mounting
    Through Hole
  • Package Height
    18.9(Max)
  • Package Width
    5(Max)
  • Package Length
    16.2(Max)
  • PCB changed
    3
  • Tab
    Tab
  • Standard Package Name
    TO
  • Supplier Package
    TO-3PN
  • Pin Count
    3
  • Lead Shape
    Through Hole

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Documentation and Resources

Datasheets
Design resources