Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
COMPONENTS
Automotive
No
PPAP
No
Category
Power MOSFET
Configuration
Single Quad Drain
Channel Mode
Enhancement
Channel Type
P
Number of Elements per Chip
1
Maximum Drain-Source Voltage (V)
60
Maximum Gate-Source Voltage (V)
±20
Maximum Gate Threshold Voltage (V)
3
Operating Junction Temperature (°C)
-55 to 150
Maximum Continuous Drain Current (A)
7.3
Maximum Gate-Source Leakage Current (nA)
100
Maximum IDSS (uA)
1
Maximum Drain-Source Resistance (mOhm)
105@10V
Typical Gate Charge @ Vgs (nC)
8.2@4.5V|17.2@10V
Typical Gate Charge @ 10V (nC)
17.2
Typical Gate to Drain Charge (nC)
3.1
Typical Gate to Source Charge (nC)
3
Typical Reverse Recovery Charge (nC)
6.18
Typical Input Capacitance @ Vds (pF)
969@30V
Typical Reverse Transfer Capacitance @ Vds (pF)
44@30V
Minimum Gate Threshold Voltage (V)
1
Typical Output Capacitance (pF)
57
Maximum Power Dissipation (mW)
1800
Typical Fall Time (ns)
42
Typical Rise Time (ns)
23
Typical Turn-Off Delay Time (ns)
34
Typical Turn-On Delay Time (ns)
4.4
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Supplier Temperature Grade
Automotive
Packaging
Tape and Reel
Typical Drain-Source Resistance @ 25°C (mOhm)
80@4V|65@8V|60@12V|57.5@16V|55@20V
Maximum Power Dissipation on PCB @ TC=25°C (W)
1.8
Maximum Pulsed Drain Current @ TC=25°C (A)
24
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
105
Typical Diode Forward Voltage (V)
0.7
Typical Gate Plateau Voltage (V)
3.2
Typical Reverse Recovery Time (ns)
13.2
Maximum Diode Forward Voltage (V)
1.2
Maximum Positive Gate-Source Voltage (V)
20
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
7.3
Mounting
Surface Mount
Package Height
0.9(Max)
Package Width
1.6
Package Length
2.9
PCB changed
6
Standard Package Name
SOT
Supplier Package
TSOT-26
Pin Count
6
Lead Shape
Gull-wing
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