Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8541.29.00.55
Automotive
No
PPAP
No
Category
Power MOSFET
Configuration
Single Quad Drain
Channel Mode
Enhancement
Channel Type
P
Number of Elements per Chip
1
Maximum Drain-Source Voltage (V)
30
Maximum Gate-Source Voltage (V)
±25
Maximum Gate Threshold Voltage (V)
3
Operating Junction Temperature (°C)
-55 to 150
Maximum Continuous Drain Current (A)
8.7
Maximum Gate-Source Leakage Current (nA)
10000
Maximum IDSS (uA)
1
Maximum Drain-Source Resistance (mOhm)
19@10V
Typical Gate Charge @ Vgs (nC)
9.2@4.5V|19.6@10V
Typical Gate Charge @ 10V (nC)
19.6
Typical Gate to Drain Charge (nC)
3.9
Typical Gate to Source Charge (nC)
4.3
Typical Reverse Recovery Charge (nC)
3.3
Typical Input Capacitance @ Vds (pF)
1204@15V
Typical Reverse Transfer Capacitance @ Vds (pF)
112@15V
Minimum Gate Threshold Voltage (V)
1
Typical Output Capacitance (pF)
154
Maximum Power Dissipation (mW)
2000
Typical Fall Time (ns)
26
Typical Rise Time (ns)
23
Typical Turn-Off Delay Time (ns)
34
Typical Turn-On Delay Time (ns)
5.3
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Packaging
Tape and Reel
Typical Drain-Source Resistance @ 25°C (mOhm)
15@10V|28@4.5V|34@4V
Maximum Power Dissipation on PCB @ TC=25°C (W)
2
Maximum Pulsed Drain Current @ TC=25°C (A)
50
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
175
Typical Diode Forward Voltage (V)
0.7
Typical Gate Plateau Voltage (V)
4
Typical Reverse Recovery Time (ns)
10
Maximum Diode Forward Voltage (V)
1.2
Maximum Positive Gate-Source Voltage (V)
25
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
8.7
Mounting
Surface Mount
Package Height
0.57
Package Width
2
Package Length
2
PCB changed
6
Standard Package Name
DFN
Supplier Package
UDFN EP
Pin Count
6
Lead Shape
No Lead
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