Specialized Power ICs and Modules

DLPC230TZDQQ1

Digital Micromirror Device 324-Pin BGA Tray Automotive AEC-Q100

Texas Instruments

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.31.00.30

• Automotive

  Yes

• PPAP

  Yes

• Type

  Digital Micromirror Device

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.73

• Package Width

  23.2(Max)

• Package Length

  23.2(Max)

• PCB changed

  324

• Standard Package Name

  BGA

• Supplier Package

  BGA

• Pin Count

  324