Product Technical Specifications
EU RoHS
Not Compliant
ECCN (US)
3A991
Part Status
Active
HTS
EA
Automotive
No
PPAP
No
Module
DRAM
Subcategory
DDR4 SDRAM
Module Density
4Gbyte
Organization
512Mx72
Module Type
DIMM
Chip Density (bit)
8G
Data Bus Width (bit)
72
Maximum Clock Rate (MHz)
2133
Chip Configuration
512Mx16
Chip Package Type
PBGA
Minimum Operating Supply Voltage (V)
1.14
Typical Operating Supply Voltage (V)
1.2
Maximum Operating Supply Voltage (V)
1.26
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
105
Supplier Temperature Grade
Extended
ECC Support
Yes
CAS Latency
19
Mounting
Surface Mount
Package Height
1.62
Package Width
15
Package Length
20
PCB changed
391
Standard Package Name
BGA
Supplier Package
PBGA
Pin Count
391

