DRAM Chip

D1611PM3BDGUI-U

DRAM Chip Mobile LPDDR4 SDRAM 16Gbit 1Gx16 1.1V/1.8V 200-Pin FBGA

Kingston Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• HTS

  8542.32.00.36

• SVHC

  Yes

• SVHC Exceeds Threshold

  Yes

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR4 SDRAM

• Chip Density (bit)

  16G

• Organization

  1Gx16

• Number of Internal Banks

  8

• Number of Words per Bank

  128M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  3733

• Maximum Access Time (ns)

  3.6

• Address Bus Width (bit)

  20

• Minimum Operating Supply Voltage (V)

  1.7|1.06

• Maximum Operating Supply Voltage (V)

  1.95|1.17

• Operating Current (mA)

  205

• Minimum Operating Temperature (°C)

  -25

• Maximum Operating Temperature (°C)

  85

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  0.48

• Package Width

  10

• Package Length

  14.5

• PCB changed

  200

• Supplier Package

  FBGA

• Pin Count

  200