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CYT3DLBBHBQ1BZSGS|INFINEON|simage
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Microcontrollers - MCUs

CYT3DLBBHBQ1BZSGS

MCU 32-bit ARM Cortex M0+/ARM Cortex M7 RISC 4160KB Flash 3.3V/5V 272-Pin BGA Tray

Infineon Technologies AG
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992.c
  • Part Status
    Active
  • HTS
    8542.31.00.25
  • Automotive
    Yes
  • PPAP
    Unknown
  • Family Name
    T2G
  • Instruction Set Architecture
    RISC
  • Device Core
    ARM Cortex M7|ARM Cortex M0+
  • Core Architecture
    ARM
  • Maximum CPU Frequency (MHz)
    240|100
  • Maximum Clock Frequency (MHz)
    240|100
  • Data Bus Width (bit)
    32
  • Program Memory Type
    Flash
  • Program Memory Size
    4160KB
  • RAM Size
    384KB
  • Programmability
    Yes
  • Interface Type
    CAN/Ethernet/I2C/LIN/SPI/UART
  • Number of I/Os
    135
  • No. of Timers
    2
  • Number of ADCs
    1
  • ADC Channels
    48
  • ADC Resolution (bit)
    12
  • Number of DACs
    1
  • DAC Channels
    1
  • USART
    0
  • UART
    12
  • USB
    0
  • SPI
    12
  • I2C
    12
  • I2S
    0
  • CAN
    4
  • Ethernet
    1
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3.3|5
  • Maximum Operating Supply Voltage (V)
    5.5
  • Maximum Power Dissipation (mW)
    2500
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • PCB changed
    272
  • Standard Package Name
    BGA
  • Supplier Package
    BGA
  • Pin Count
    272
Order Quantity

Documentation and Resources

Datasheets
Design resources