SRAM Chip

CY7C1612KV18-300BZXI

SRAM Chip Sync Dual 1.8V 144M-bit 8M x 18 0.45ns 165-Pin FBGA Tray

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.2.a.

• Part Status

  Active

• HTS

  8542.32.00.41

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  144M

• Number of Words

  8M

• Number of Bits/Word (bit)

  18

• Architecture

  Pipelined

• Data Rate Architecture

  QDR

• Address Bus Width (bit)

  44

• Number of Ports

  2

• Timing Type

  Synchronous

• Max. Access Time (ns)

  0.45

• Maximum Clock Rate (MHz)

  300

• Process Technology

  65nm

• Minimum Operating Supply Voltage (V)

  1.7

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  1.9

• Operating Current (mA)

  910

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.89

• Package Width

  15

• Package Length

  17

• PCB changed

  165

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  165

• Lead Shape

  Ball