SRAM Chip

CY7C1041G30-10BVXI

SRAM Chip Async Single 2.5V/3.3V 4M-bit 256K x 16 10ns 48-Pin VFBGA Tray

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.2.b.

• Part Status

  Active

• HTS

  8542.32.00.41

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  4M

• Number of Words

  256K

• Number of Bits/Word (bit)

  16

• Data Rate Architecture

  SDR

• Address Bus Width (bit)

  18

• Number of Ports

  1

• Timing Type

  Asynchronous

• Max. Access Time (ns)

  10

• Process Technology

  65nm

• Minimum Operating Supply Voltage (V)

  2.2

• Typical Operating Supply Voltage (V)

  2.5|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  45

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.74(Max)

• Package Width

  6

• Package Length

  8

• PCB changed

  48

• Standard Package Name

  BGA

• Supplier Package

  VFBGA

• Pin Count

  48

• Lead Shape

  Ball