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CY14B108MZSP25XI|INFINEON|simage
CY14B108MZSP25XI|INFINEON|limage
NVRAM

CY14B108M-ZSP25XI

NVRAM NVSRAM Parallel 8Mbit 3V 54-Pin TSOP-II Tray

Infineon Technologies AG
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991b.2.a.
  • Part Status
    Active
  • HTS
    8542.32.00.41
  • Automotive
    No
  • PPAP
    No
  • NVRAM Type
    NVSRAM
  • Chip Density (bit)
    8M
  • Organization
    512Kx16
  • Data Bus Width (bit)
    16
  • Maximum Access Time (ns)
    25
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    75
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.05(Max)
  • Package Width
    10.26(Max)
  • Package Length
    22.52(Max)
  • PCB changed
    54
  • Standard Package Name
    SO
  • Supplier Package
    TSOP-II
  • Pin Count
    54
  • Lead Shape
    Gull-wing
Order Quantity

Documentation and Resources

Datasheets
Design resources