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MOSFETs

BSZ900N15NS3GATMA1

Trans MOSFET N-CH 150V 13A 8-Pin TSDSON EP T/R

Infineon Technologies AG
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    COMPONENTS
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    Yes
  • PPAP
    Unknown
  • Category
    Power MOSFET
  • Configuration
    Single Quad Drain Triple Source
  • Channel Mode
    Enhancement
  • Channel Type
    N
  • Number of Elements per Chip
    1
  • Maximum Drain-Source Voltage (V)
    150
  • Maximum Gate-Source Voltage (V)
    ±20
  • Maximum Gate Threshold Voltage (V)
    4
  • Operating Junction Temperature (°C)
    -55 to 150
  • Maximum Continuous Drain Current (A)
    13
  • Maximum Gate-Source Leakage Current (nA)
    100
  • Maximum IDSS (uA)
    1
  • Maximum Drain-Source Resistance (mOhm)
    90@10V
  • Typical Gate Charge @ Vgs (nC)
    5@10V
  • Typical Gate Charge @ 10V (nC)
    5
  • Typical Gate to Drain Charge (nC)
    0.9
  • Typical Gate to Source Charge (nC)
    1.9
  • Typical Reverse Recovery Charge (nC)
    123
  • Typical Switch Charge (nC)
    1.7
  • Typical Input Capacitance @ Vds (pF)
    380@75V
  • Typical Reverse Transfer Capacitance @ Vds (pF)
    3@75V
  • Minimum Gate Threshold Voltage (V)
    2
  • Typical Output Capacitance (pF)
    46
  • Maximum Power Dissipation (mW)
    38000
  • Typical Fall Time (ns)
    3
  • Typical Rise Time (ns)
    4
  • Typical Turn-Off Delay Time (ns)
    8
  • Typical Turn-On Delay Time (ns)
    4
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Packaging
    Tape and Reel
  • Typical Drain-Source Resistance @ 25°C (mOhm)
    74@10V|75@8V
  • Maximum Pulsed Drain Current @ TC=25°C (A)
    52
  • Typical Diode Forward Voltage (V)
    0.9
  • Typical Reverse Recovery Time (ns)
    59
  • Maximum Diode Forward Voltage (V)
    1.2
  • Typical Gate Threshold Voltage (V)
    3
  • Maximum Positive Gate-Source Voltage (V)
    20
  • Mounting
    Surface Mount
  • Package Height
    1.05(Max)
  • Package Width
    3.3
  • Package Length
    3.3
  • PCB changed
    8
  • Standard Package Name
    SON
  • Supplier Package
    TSDSON EP
  • Pin Count
    8
  • Lead Shape
    No Lead

Documentation and Resources

Datasheets
Design resources