Product Technical Specifications
EU RoHS
Compliant with Exemption
ECCN (US)
EAR99
Part Status
Active-Unconfirmed
HTS
COMPONENTS
Configuration
Dual Common Source
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
2
Mode of Operation
Pulsed RF
Process Technology
0.14um
Maximum Drain-Source Voltage (V)
135
Maximum Gate-Source Voltage (V)
11
Maximum Gate Threshold Voltage (V)
2.25
Maximum VSWR
65
Maximum Gate-Source Leakage Current (nA)
140
Maximum IDSS (uA)
1.4
Maximum Drain-Source Resistance (mOhm)
3200@6V
Typical Input Capacitance @ Vds (pF)
17@50V
Typical Reverse Transfer Capacitance @ Vds (pF)
0.2@50V
Typical Output Capacitance @ Vds (pF)
7.5@50V
Maximum Output Power (W)
35(Typ)
Typical Power Gain (dB)
27
Maximum Frequency (MHz)
600
Minimum Frequency (MHz)
10
Typical Drain Efficiency (%)
75
Minimum Operating Temperature (°C)
-65
Maximum Operating Temperature (°C)
225
Packaging
Tape and Reel
Mounting
Surface Mount
Package Height
3.6
Package Width
9.96
Package Length
20.57
PCB changed
4
Standard Package Name
SO
Supplier Package
HSOP-F
Pin Count
4
Lead Shape
Flat