DRAM Chip

B5116ECMDXGJDI-U

DRAM Chip DDR3L SDRAM 8Gbit 512Mx16 1.35V 96-Pin FBGA Tray

Kingston Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Unconfirmed

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3L SDRAM

• Chip Density (bit)

  8G

• Organization

  512Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  64M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1866

• Address Bus Width (bit)

  19

• Minimum Operating Supply Voltage (V)

  1.283

• Maximum Operating Supply Voltage (V)

  1.45

• Operating Current (mA)

  360

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Width

  9

• Package Length

  13.5

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  96

• Lead Shape

  Ball