DRAM Chip
B3221PM3BDGUI-U
DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 2Gx16 1.1V/1.8V 200-Pin FBGA
Kingston TechnologyProduct Technical Specifications
EU RoHS
Compliant
ECCN (US)
4A994a.
HTS
8542.32.00.02
SVHC
Yes
SVHC Exceeds Threshold
Yes
Automotive
No
PPAP
No
DRAM Type
Mobile LPDDR4 SDRAM
Chip Density (bit)
32G
Organization
2Gx16
Number of Internal Banks
8
Number of Words per Bank
256M
Number of Bits/Word (bit)
16
Data Bus Width (bit)
16
Maximum Clock Rate (MHz)
3733
Maximum Access Time (ns)
3.6
Address Bus Width (bit)
20
Minimum Operating Supply Voltage (V)
1.06|1.7
Maximum Operating Supply Voltage (V)
1.17|1.95
Operating Current (mA)
205
Minimum Operating Temperature (°C)
-25
Maximum Operating Temperature (°C)
85
Number of I/O Lines (bit)
16
Mounting
Surface Mount
Package Height
0.48
Package Width
10
Package Length
14.5
PCB changed
200
Supplier Package
FBGA
Pin Count
200

