Microcontrollers - MCUs

AE302F80F55D5LE-Y

FBGA - Fully featured MAX E3 with 2xM-55,2xU-55 with 5.5MB NV RAM and 13.5MB SRAM

Alif Semiconductor

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  5A002

• Part Status

  Active

• HTS

  8542.31.00.25

• Automotive

  Unknown

• PPAP

  Unknown

• Family Name

  Ensemble

• Instruction Set Architecture

  RISC

• Device Core

  ARM Cortex M55

• Core Architecture

  ARM

• Maximum CPU Frequency (MHz)

  400

• Maximum Clock Rate (MHz)

  400

• Data Bus Width (bit)

  32

• RAM Size

  13.5MB

• Interface Type

  CAN/Ethernet/I2C/I2S/I3C/SPI/UART/USB

• Number of I/Os

  120

• No. of Timers

  16

• Number of ADCs

  4

• ADC Channels

  18/18/18/4

• ADC Resolution (bit)

  12/12/12/24

• Number of DACs

  1

• DAC Channels

  2

• DAC Resolution (bit)

  12

• USART

  0

• UART

  9

• USB

  1

• SPI

  5

• I2C

  5

• I2S

  5

• CAN

  1

• Ethernet

  1

• Minimum Operating Supply Voltage (V)

  1.62

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  1.98

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Extended

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.96

• Package Width

  10

• Package Length

  10

• PCB changed

  194

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  194