Connector Headers and PCB Receptacles
2048430001
Conn Board to Board HDR 699 POS Solder ST Top Entry SMD Mirror Mezz T/R
Molex
Mirror Mezz Connectors
Mirror Mezz Connectors provide solutions for high-density applications and next-generation data centers. Engineered to deliver exceptional data speeds, Molex OCP-standard hermaphroditic mezzanine connectors are perfect for telecommunications, AI and networking sectors. With a unique design that minimizes costs and maximizes space efficiency, Mirror Mezz Connectors optimize performance and signal integrity.
See Mirror Mezz Connectors Datasheet
Key Features:
Mirror Mezz Connectors
- Reduces mis-mating and assembly errors through a robust shrouded housing design
- Eases design challenges by maximizing PCB real estate
- Offers increased reliability and minimizes crosstalk between rows
- Simplifies assembly operations
Mirror Mezz & Mirror Mezz Pro Connectors
- Delivers reliable high-speed data transmission rates
- Improves design flexibility with 15x11 OCP-compliant design
- Offers relaxed tolerances and greater architectural flexibility with flex cable links
Mirror Mezz Enhanced Connectors
- Delivers high-speed data transmission rates for next-gen applications
- Maximizes high-speed performance and clean routing out of the connector footprint
- Permits seamless upgrades to 224Gbps speeds
- Optimizes PCB real estate with higher differential pair (DP) density
| Speed | Up to 224Gbps (Mirror Mezz Enhanced) Up to 112Gbps (Mirror Mezz, Mirror Mezz Pro) |
| Pin Count | Up to 270 differential pairs (DPs) |
| Connector Height | 2.50 or 5.50mm |
| Stack Height | 5.00, 8.00 or 11.00mm |
| Standard | OCP 15x11 (Mirror Mezz, Mirror Mezz Pro) |
| Operating Temperatures | -40 to +105°C |
Markets & Applications
Server and Storage
- Networking
- Storage
- Servers
Telecommunications
- Infrastructure
- Networking Systems
Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8536.69.40.40
Automotive
No
PPAP
No
Type
Board to Board
Gender
HDR
Number of Contacts
699
Number of Rows
11
Termination Method
Solder
Body Orientation
Straight
Row Spacing (mm)
1.5
Maximum Current Rating (A)
(0.75/1.2)/Contact
Maximum Voltage Rating
30VAC|30VDC
Insulation Resistance (MOhm)
1000
Maximum Contact Resistance (mOhm)
30
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
105
Mating Cycle (Cycles)
100
Packaging
Tape and Reel
Product Weight (g)
5.257
Product Length (mm)
64.7
Product Depth (mm)
20.1
Product Height (mm)
4.91
Tradename
Mirror Mezz
Contact Plating Thickness
(0.76/1.27)um
Mounting
Surface Mount
Order Quantity