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0461.500ER|LTLFUWIC|limage
0461.500ER|LTLFUWIC|simage
Fuses

0461.500ER

Fuse Chip Slow Blow Acting 0.5A 600V SMD Solder Pad 10.1 X 3.12mm Ceramic T/R CSA

Littelfuse
Datasheets 

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Product Technical Specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    COMPONENTS
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Slow Blow
  • Application
    Baystations T1/E/J1,T3(DS3) Trunk Cards, Ethernet 10/100/1000Base T, xDSL Applications ADSL,ADSL2+,VSDL and VDSL2+
  • Fuse Size (mm)
    10.1 X 3.12
  • Current Rating (A)
    0.5
  • Maximum Voltage Rating (V)
    600
  • Maximum AC Voltage Rating (V)
    600
  • Maximum DC Voltage Rating (V)
    80
  • Breaking Capacity @ Rated Voltage (A)
    60@600VAC, 50@250VAC, 100@80VDC
  • Typical Melting I2t (A²S)
    0.84
  • Typical Cold Resistance (Ohm)
    0.56
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    3.12
  • Product Length (mm)
    10.1
  • Product Height (mm)
    3.12
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Family/Series
    461
  • ROHS Version
    2011/65/EU, 2015/863
  • Quantity Packaging
    2500
  • MSL
    1
Order Quantity

Documentation and Resources

Datasheets
Design resources