플래시

W25Q256JWBIQ

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 256M-bit 32M x 8 6ns 24-Pin TFBGA T/R/Tray/Tube

Winbond Electronics

제품 기술 사양

• 유럽 연합 RoHS 명령어

  Compliant

• 미국수출통제분류ECCN 인코딩

  3A991b.1.a.

• 친환경 무연

  Active

• 미국 세관 상품 코드

  COMPONENTS

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  256M

• Architecture

  Sectored

• Boot Block

  No

• Block Organization

  Symmetrical

• Address Width (bit)

  32

• Sector Size

  4Kbyte x 8192

• Page Size

  256byte

• Number of Bits/Word (bit)

  8

• Number of Words

  32M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  6

• Maximum Erase Time (s)

  400/Chip

• Maximum Programming Time (ms)

  5/Page

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Maximum Operating Frequency (MHz)

  133

• Minimum Operating Supply Voltage (V)

  1.7

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  1.95

• Programming Voltage (V)

  1.7 to 1.95

• Operating Current (mA)

  20

• Program Current (mA)

  20

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Mounting

  Surface Mount

• Package Height

  0.85

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  24