MT35XU02GCBA1G120SIT|MICRON|limage
MT35XU02GCBA1G120SIT|MICRON|simage
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MT35XU02GCBA1G12-0SIT

NOR Flash Serial-SPI 1.8V 2G-bit 256M x 8 24-Pin TBGA Tray

Micron Technology
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제품 기술 사양
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    3A991b.1.a.
  • Stato del componente
    LTB
  • Codice HTS
    COMPONENTS
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    2G
  • Architecture
    Sectored
  • Boot Block
    Yes
  • Block Organization
    Symmetrical
  • Address Width (bit)
    32
  • Sector Size
    128Kbyte x 2048
  • Page Size
    256byte
  • Number of Bits/Word (bit)
    8
  • Number of Words
    256M
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Interface Type
    Serial-SPI
  • Minimum Operating Supply Voltage (V)
    1.7
  • Typical Operating Supply Voltage (V)
    1.8
  • Maximum Operating Supply Voltage (V)
    2
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • PCB changed
    24
  • Standard Package Name
    BGA
  • Supplier Package
    TBGA
  • Pin Count
    24
  • Lead Shape
    Ball

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