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K4FBE3D4HMGHCL02V|SAMSUNG|simage
K4FBE3D4HMGHCL02V|SAMSUNG|limage
DRAM 칩

K4FBE3D4HM-GHCL02V

DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 1Gx32 1.1V/1.8V 200-Pin FPGA

Samsung Electronics
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제품 기술 사양
  • 유럽 연합 RoHS 명령어
    Supplier Unconfirmed
  • 미국수출통제분류ECCN 인코딩
    EAR99
  • 친환경 무연
    Obsolete
  • 미국 세관 상품 코드
    8542.32.00.36
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    Mobile LPDDR4 SDRAM
  • Chip Density (bit)
    32G
  • Organization
    1Gx32
  • Number of Bits/Word (bit)
    32
  • Data Bus Width (bit)
    32
  • Maximum Clock Rate (MHz)
    4266
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Number of I/O Lines (bit)
    32
  • Mounting
    Surface Mount
  • PCB changed
    200
  • Supplier Package
    FPGA
  • Pin Count
    200

문서 및 자료

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