IS61NLP102418B200B3LI|ISSI|simage
IS61NLP102418B200B3LI|ISSI|limage
SRAM 칩

IS61NLP102418B-200B3LI

SRAM Chip Sync Quad 3.3V 18M-bit 1M x 18 3ns 165-Pin TFBGA

Integrated Silicon Solution Inc
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제품 기술 사양
  • 유럽 연합 RoHS 명령어
    Compliant
  • 미국수출통제분류ECCN 인코딩
    EAR99
  • 친환경 무연
    Active
  • 미국 세관 상품 코드
    8542.32.00.41
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    18M
  • Number of Words
    1M
  • Number of Bits/Word (bit)
    18
  • Architecture
    Pipelined
  • Data Rate Architecture
    SDR
  • Address Bus Width (bit)
    20
  • Number of Ports
    4
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    3
  • Maximum Clock Rate (MHz)
    200
  • Minimum Operating Supply Voltage (V)
    3.135
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.465
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Mounting
    Surface Mount
  • Package Height
    0.79
  • Package Width
    13
  • Package Length
    15
  • PCB changed
    165
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    165
  • Lead Shape
    Ball

문서 및 자료

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