์ ํ ๊ธฐ์ ์ฌ์
์ ๋ฝ ์ฐํฉ RoHS ๋ช ๋ น์ด
Compliant with Exemption
๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ
EAR99
์นํ๊ฒฝ ๋ฌด์ฐ
Active
๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋
8541.29.00.55
SVHC
Yes
SVHC ๊ธฐ์ค ์ด๊ณผ
Yes
Automotive
No
PPAP
No
Category
Power MOSFET
Material
Si
Configuration
Single
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
1
Maximum Drain-Source Voltage (V)
55
Maximum Gate-Source Voltage (V)
ยฑ16
Maximum Gate Threshold Voltage (V)
3
Operating Junction Temperature (ยฐC)
-55 to 175
Maximum Continuous Drain Current (A)
61
Maximum Gate-Source Leakage Current (nA)
200
Maximum IDSS (uA)
20
Maximum Drain-Source Resistance (mOhm)
14@10V
Typical Gate Charge @ Vgs (nC)
61@10V
Typical Gate Charge @ 10V (nC)
61
Typical Gate to Drain Charge (nC)
17
Typical Gate to Source Charge (nC)
9
Typical Reverse Recovery Charge (nC)
110
Typical Input Capacitance @ Vds (pF)
1870@25V
Typical Reverse Transfer Capacitance @ Vds (pF)
74@25V
Minimum Gate Threshold Voltage (V)
1
Typical Output Capacitance (pF)
2380
Maximum Power Dissipation (mW)
120000
Typical Fall Time (ns)
100
Typical Rise Time (ns)
51
Typical Turn-Off Delay Time (ns)
83
Typical Turn-On Delay Time (ns)
7.4
Minimum Operating Temperature (ยฐC)
-55
Maximum Operating Temperature (ยฐC)
175
Packaging
Tape and Reel
Typical Drain-Source Resistance @ 25ยฐC (mOhm)
12@10V|14@5V
Maximum Pulsed Drain Current @ TC=25ยฐC (A)
240
Maximum Junction Ambient Thermal Resistance on PCB (ยฐC/W)
50
Typical Gate Plateau Voltage (V)
2.8
Typical Reverse Recovery Time (ns)
62
Maximum Diode Forward Voltage (V)
1.3
Maximum Positive Gate-Source Voltage (V)
16
Mounting
Surface Mount
Package Height
2.29
Package Width
6.1
Package Length
6.54
PCB changed
2
Tab
Tab
Standard Package Name
TO
Supplier Package
DPAK
Pin Count
3
Lead Shape
Gull-wing
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