콤보 무선 모듈

88W9064-A1-BWPC/AK

WLAN+BT Chip 160MHz 358-Pin LFBGA Tray

NXP Semiconductors

제품 기술 사양

• 유럽 연합 RoHS 명령어

  Compliant

• 미국수출통제분류ECCN 인코딩

  5A992.c

• 친환경 무연

  LTB

• 미국 세관 상품 코드

  8542.39.00.10

• Automotive

  No

• PPAP

  No

• Construction

  WLAN+BT

• Style

  Chip

• WLAN Maximum Data Rate (Mbps)

  2400

• WLAN Frequency Range (MHz)

  160

• Packaging

  Tray

• BT Protocol Supported

  Bluetooth v5.0(BLE)

• WLAN Technology

  IEEE 802.11a/b/g/n/ac

• Mounting

  Surface Mount

• Package Height

  0.89

• Package Width

  15

• Package Length

  15

• PCB changed

  358

• Standard Package Name

  BGA

• Supplier Package

  LFBGA

• Pin Count

  358