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SST39WF800B704CB3KE|MICROCHP|simage
SST39WF800B704CB3KE|MICROCHP|limage
Flash

SST39WF800B-70-4C-B3KE

NOR Flash Parallel 1.8V 8M-bit 512K x 16 70ns 48-Pin TFBGA Tray

Microchip Technology
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제품 기술 사양
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Part Status
    Active
  • HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    8M
  • Architecture
    Sectored
  • Boot Block
    No
  • Block Organization
    Symmetrical
  • Address Width (bit)
    19
  • Sector Size
    4Kbyte x 256
  • Number of Bits/Word (bit)
    16
  • Number of Words
    512K
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Max. Access Time (ns)
    70
  • Maximum Erase Time (s)
    0.2/Chip
  • Maximum Programming Time (ms)
    0.04/Word
  • OE Access Time (ns)
    35
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    1.65
  • Typical Operating Supply Voltage (V)
    1.8
  • Maximum Operating Supply Voltage (V)
    1.95
  • Programming Voltage (V)
    1.65 to 1.95
  • Operating Current (mA)
    15
  • Program Current (mA)
    20
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    70
  • Supplier Temperature Grade
    Commercial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    10000
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.75
  • Package Width
    6
  • Package Length
    8
  • PCB changed
    48
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    48
  • Lead Shape
    Ball

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