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W634GU6RB11I|WINBOND|simage
W634GU6RB11I|WINBOND|limage
Chip DRAM

W634GU6RB11I

DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin VFBGA T/R

Winbond Electronics
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Specifiche Tecniche del Prodotto
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    DDR3L SDRAM
  • Chip Density (bit)
    4G
  • Organization
    256Mx16
  • Number of Internal Banks
    8
  • Number of Words per Bank
    32M
  • Number of Bits/Word (bit)
    16
  • Data Bus Width (bit)
    16
  • Maximum Clock Rate (MHz)
    1866
  • Maximum Access Time (ns)
    0.195
  • Address Bus Width (bit)
    18
  • Minimum Operating Supply Voltage (V)
    1.283
  • Maximum Operating Supply Voltage (V)
    1.45
  • Operating Current (mA)
    121
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    95
  • Supplier Temperature Grade
    Industrial
  • Number of I/O Lines (bit)
    16
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    0.6(Max)
  • Package Width
    7.5
  • Package Length
    13
  • PCB changed
    96
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    96
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Documentazione e Risorse

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Risorse di progettazione