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W25Q01JVSFIM

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 16-Pin SOIC

Winbond Electronics
Schede tecniche 

Specifiche Tecniche del Prodotto
  • 유럽 연합 RoHS 명령어
    Compliant
  • 미국수출통제분류ECCN 인코딩
    3A991.b.1.a
  • 친환경 무연
    Active
  • 미국 세관 상품 코드
    8542.32.00.71
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    1G
  • Architecture
    Sectored
  • Boot Block
    No
  • Block Organization
    Symmetrical
  • Address Width (bit)
    31
  • Timing Type
    Synchronous
  • Maximum Erase Time (s)
    2/Block
  • Maximum Programming Time (ms)
    3
  • Interface Type
    Serial (SPI, Dual SPI, Quad SPI)
  • Minimum Operating Supply Voltage (V)
    2.7
  • Maximum Operating Frequency (MHz)
    133
  • Typical Operating Supply Voltage (V)
    3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.7 to 3.6
  • Program Current (mA)
    25
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Mounting
    Surface Mount
  • Package Height
    2.31
  • Package Width
    7.49
  • Package Length
    10.31
  • PCB changed
    16
  • Standard Package Name
    SO
  • Supplier Package
    SOIC
  • Pin Count
    16
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Documentazione e Risorse

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Risorse di progettazione