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MR0A16AVYS35|EVERSPIN|simage
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Dev Kit

MR0A16AVYS35

MRAM 1Mbit Parallel Interface 3.3V 44-Pin TSOP-II Tray

Everspin Technologies
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Specifiche Tecniche del Prodotto
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8542.32.00.41
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    1M
  • Density Range (bit)
    256K to 8M
  • Organization
    64Kx16
  • Data Bus Width (bit)
    16
  • Max. Access Time (ns)
    35
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    3
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    165
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Supplier Temperature Grade
    Extended
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.05(Max) mm
  • Package Width
    10.29(Max) mm
  • Package Length
    18.54(Max) mm
  • PCB changed
    44
  • Standard Package Name
    SO
  • Supplier Package
    TSOP-II
  • Pin Count
    44
  • Lead Shape
    Gull-wing

Documentazione e Risorse

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Risorse di progettazione