Dev Kit

MR0A16AMYS35

MRAM 1Mbit Parallel Interface 3.3V Automotive AEC-Q100 44-Pin TSOP-II Tray

Everspin Technologies

Specifiche Tecniche del Prodotto

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Active

• Codice HTS

  8542.32.00.71

• Automotive

  Yes

• PPAP

  Unknown

• Chip Density (bit)

  1M

• Density Range (bit)

  256K to 8M

• Organization

  64Kx16

• Data Bus Width (bit)

  16

• Max. Access Time (ns)

  35

• Interface Type

  Parallel

• Minimum Operating Supply Voltage (V)

  3

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  165

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.05(Max)

• Package Width

  10.29(Max)

• Package Length

  18.54(Max)

• PCB changed

  44

• Standard Package Name

  SO

• Supplier Package

  TSOP-II

• Pin Count

  44

• Lead Shape

  Gull-wing