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MK60FX512VMD15|NXP|simage
MK60FX512VMD15|NXP|limage
마이크로컨트롤러 - MCU

MK60FX512VMD15

MCU 32-bit ARM Cortex M4 RISC 512KB Flash 3.3V Automotive 144-Pin MAP-BGA Tray

NXP Semiconductors
Schede tecniche 

Specifiche Tecniche del Prodotto
  • 유럽 연합 RoHS 명령어
    Compliant
  • 미국수출통제분류ECCN 인코딩
    3A991a.2.
  • 친환경 무연
    Active
  • 미국 세관 상품 코드
    8542.31.00.25
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Yes
  • Family Name
    K60
  • Instruction Set Architecture
    RISC
  • Device Core
    ARM Cortex M4
  • Core Architecture
    ARM
  • Maximum CPU Frequency (MHz)
    150
  • Maximum Clock Rate (MHz)
    150
  • Data Bus Width (bit)
    32
  • Program Memory Type
    Flash
  • Program Memory Size
    512KB
  • RAM Size
    128KB
  • Maximum Expanded Memory Size
    512KB
  • Programmability
    Yes
  • Interface Type
    CAN/Ethernet/I2C/I2S/SPI/UART/USB
  • Number of I/Os
    100
  • No. of Timers
    11
  • PWM
    2
  • Number of ADCs
    4
  • ADC Channels
    58
  • ADC Resolution (bit)
    16/16/16/16
  • Number of DACs
    1
  • DAC Channels
    2
  • DAC Resolution (bit)
    12
  • USART
    0
  • UART
    6
  • USB
    1
  • SPI
    3
  • I2C
    2
  • I2S
    0
  • CAN
    2
  • Ethernet
    1
  • Analog Comparators
    4
  • Parallel Master Port
    No
  • Real Time Clock
    No
  • Special Features
    CAN Controller
  • Minimum Operating Supply Voltage (V)
    1.71
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Supplier Temperature Grade
    Industrial
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.27(Max)
  • Package Width
    13
  • Package Length
    13
  • PCB changed
    144
  • Standard Package Name
    BGA
  • Supplier Package
    MAP-BGA
  • Pin Count
    144
  • Lead Shape
    Ball

Documentazione e Risorse

Schede tecniche
Risorse di progettazione