Chip DRAM

IS43TR82560D-125KBLI

DRAM Chip DDR3 SDRAM 2Gbit 256Mx8 1.5V 78-Pin TW-BGA

Integrated Silicon Solution Inc

Specifiche Tecniche del Prodotto

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Active

• Codice HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3 SDRAM

• Chip Density (bit)

  2G

• Organization

  256Mx8

• Number of Internal Banks

  8

• Number of Words per Bank

  32M

• Number of Bits/Word (bit)

  8

• Data Bus Width (bit)

  8

• Maximum Clock Rate (MHz)

  1600

• Maximum Access Time (ns)

  0.225

• Address Bus Width (bit)

  18

• Minimum Operating Supply Voltage (V)

  1.425

• Maximum Operating Supply Voltage (V)

  1.575

• Operating Current (mA)

  147

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  8

• Mounting

  Surface Mount

• Package Height

  1(Max)

• Package Width

  8

• Package Length

  10.5

• PCB changed

  78

• Standard Package Name

  BGA

• Supplier Package

  TW-BGA

• Pin Count

  78