Memorie Flash

IS25LP01G-RILA3

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 9ns Automotive AEC-Q100 24-Pin LFBGA

Integrated Silicon Solution Inc

Specifiche Tecniche del Prodotto

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  3A991.b.1.a

• Stato del componente

  Active

• Codice HTS

  8542.32.00.71

• Automotive

  Yes

• PPAP

  Yes

• Cell Type

  NOR

• Chip Density (bit)

  1G

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Location of Boot Block

  Top|Bottom

• Address Width (bit)

  32

• Sector Size

  4Kbyte x 32768

• Bank Size

  128M

• Number of Banks

  8

• Page Size

  256byte

• Number of Bits/Word (bit)

  8

• Number of Words

  128M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  9

• Maximum Erase Time (s)

  400/Chip

• Maximum Programming Time (ms)

  1/Page

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Maximum Operating Frequency (MHz)

  133

• Minimum Operating Supply Voltage (V)

  2.7

• Typical Operating Supply Voltage (V)

  3.3|3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  50

• Program Current (mA)

  45

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Supplier Temperature Grade

  Automotive

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Mounting

  Surface Mount

• Package Height

  1.04(Max)

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  LFBGA

• Pin Count

  24