Dissipatori

ICK BGA 35 X 35

Heat Sink Passive BGA Pin Array Adhesive Aluminum 16.5°C/W Black Anodized

Fischer Elektronik GmbH & Co. KG

Specifiche Tecniche del Prodotto

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Active

• Codice HTS

  8542.90.00.00

• Automotive

  No

• PPAP

  No

• Type

  Passive

• Material

  Aluminum

• Thermal Resistance

  16.5

• Fin Style

  Pin Array

• Device Cooled

  BGA

• Attachment Method

  Adhesive

• Finish

  Black Anodized

• Mounting

  Adhesive

• Product Length (mm)

  35

• Product Depth (mm)

  35

• Product Height (mm)

  6