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Heat Sink Passive Processor Pin Array Adhesive 0.5°C/W Natural Anodized

Fischer Elektronik GmbH & Co. KG

Product Technical Specifications

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Active

• Type

  Passive

• Thermal Resistance

  0.5(Max)

• Fin Style

  Pin Array

• Device Cooled

  Processor

• Attachment Method

  Adhesive

• Finish

  Natural Anodized

• Mounting

  Adhesive

• Product Length (mm)

  50

• Product Depth (mm)

  50

• Product Height (mm)

  10