Dev Kit

EM032LXQAB313IS1R

Industrial STT-MRAM

Everspin Technologies

Specifiche Tecniche del Prodotto

• Stato del componente

  Active

• Codice HTS

  EA

• SVHC

  Yes

• Tasso di SVHC superiore ai limiti consentiti

  Yes

• Automotive

  Unknown

• PPAP

  Unknown

• Mounting

  Surface Mount

• Package Height

  0.8

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TBGA

• Pin Count

  24