Arrow Electronic Components Online
DLPC2607ZVB|TI|limage
DLPC2607ZVB|TI|simage
Processori vari

DLPC2607ZVB

DLP PICO Processor 176-Pin VFBGA Tray

Texas Instruments

Specifiche Tecniche del Prodotto
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Obsolete
  • Codice HTS
    COMPONENTS
  • Automotive
    No
  • PPAP
    No
  • Type
    DLP PICO Processor
  • Packaging
    Tray
  • Minimum Operating Temperature (°C)
    -30
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    0.8(Max)
  • Package Width
    7.1(Max)
  • Package Length
    7.1(Max)
  • PCB changed
    176
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    176
  • Lead Shape
    Ball

Documentazione e Risorse

Schede tecniche
Risorse di progettazione