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0422001.MRA|LTLFUWIC|simage
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Fusibili

0422001.MRA

Fuse Chip Fast Acting 1A 250V SMD Solder Pad 2410 6.25 X 2.24 X 2.5mm Epoxy Resin T/R Automotive AEC-Q200

Littelfuse
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Specifiche Tecniche del Prodotto
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • Automotive
    Yes
  • PPAP
    Unknown
  • Type
    Chip
  • Acting
    Fast
  • Application
    Instrument Cluster|LED Lighting Automotive Navigation System|Battery Management System
  • Fuse Size (mm)
    6.25 X 2.24 X 2.5
  • Current Rating (A)
    1
  • Maximum Voltage Rating (V)
    250
  • Maximum AC Voltage Rating (V)
    250
  • Maximum DC Voltage Rating (V)
    250
  • Breaking Capacity @ Rated Voltage (A)
    50@250VAC|300@32VDC|100@125VDC|50@250VDC
  • Typical Melting I2t (A²S)
    0.611
  • Typical Cold Resistance (Ohm)
    0.0994
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    2.24
  • Product Length (mm)
    6.25
  • Product Height (mm)
    2.5
  • Fuse Material
    Epoxy Resin
  • Mounting
    Surface Mount
  • Package/Case
    2410
Quantità Ordine

Documentazione e Risorse

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