Reduced Price
Memorie Flash
W29N01HZDINF
SLC NAND Flash Parallel 1.8V 1G-bit 128M x 8 48-Pin VFBGA Tray
Winbond ElectronicsSpecifiche Tecniche del Prodotto
RoHS (Unione Europea)
Compliant
ECCN (Stati Uniti)
3A991.b.1.a
Stato del componente
Active
Codice HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
SLC NAND
Chip Density (bit)
1G
Architecture
Sectored
Boot Block
No
Block Organization
Symmetrical
Address Width (bit)
28
Sector Size
128Kbyte x 1024
Page Size
2Kbyte
Number of Bits/Word (bit)
8
Number of Words
128M
Programmability
Yes
Timing Type
Asynchronous
Maximum Erase Time (s)
0.01/Block
Maximum Programming Time (ms)
0.7/Page
Interface Type
Parallel
Minimum Operating Supply Voltage (V)
1.7
Typical Operating Supply Voltage (V)
1.8
Maximum Operating Supply Voltage (V)
1.95
Programming Voltage (V)
1.7 to 1.95
Operating Current (mA)
25
Program Current (mA)
25
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Command Compatible
No
ECC Support
Yes
Support of Page Mode
No
Minimum Endurance (Cycles)
100000
Packaging
Tray
Mounting
Surface Mount
Package Height
0.6
Package Width
6.5
Package Length
8
PCB changed
48
Standard Package Name
BGA
Supplier Package
VFBGA
Pin Count
48
Lead Shape
Ball