Memorie Flash

W25Q01NWTBIQ

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 128M x 8 7ns 24-Pin TFBGA Tube

Winbond Electronics

Specifiche Tecniche del Prodotto

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  3A991b.1.a.

• Stato del componente

  Active

• Codice HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  1G

• Architecture

  Sectored

• Boot Block

  No

• Block Organization

  Symmetrical

• Address Width (bit)

  32

• Sector Size

  4Kbyte x 32768

• Page Size

  256byte

• Number of Bits/Word (bit)

  8

• Number of Words

  128M

• Timing Type

  Synchronous

• Max. Access Time (ns)

  7

• Maximum Erase Time (s)

  400/Chip

• Maximum Programming Time (ms)

  3/Page

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Minimum Operating Supply Voltage (V)

  1.7

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  1.95

• Programming Voltage (V)

  1.7 to 1.95

• Operating Current (mA)

  40

• Program Current (mA)

  20

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Packaging

  Tube

• Mounting

  Surface Mount

• Package Height

  0.85

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  24