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SF1206S075M2|BOURNS|simage
SF1206S075M2|BOURNS|limage
Fusibili

SF-1206S075M-2

Fuse Chip Slow Blow Acting 0.75A 63V SMD Solder Pad 1206 3.2 X 1.6 X 0.85mm Ceramic T/R

Bourns
Schede tecniche 

Specifiche Tecniche del Prodotto
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8536.10.00.40
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Slow Blow
  • Application
    Battery Charger|Cell Phone|DVD|Digital Camera|Disk Drive|Industrial Controller
  • Fuse Size (mm)
    3.2 X 1.6 X 0.85
  • Current Rating (A)
    0.75
  • Maximum Voltage Rating (V)
    63
  • Maximum DC Voltage Rating (V)
    63
  • Breaking Capacity @ Rated Voltage (A)
    50@63VDC
  • Typical Melting I2t (A²S)
    0.0051
  • Typical Cold Resistance (Ohm)
    0.51
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.6
  • Product Length (mm)
    3.2
  • Product Height (mm)
    0.85
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    1206

Documentazione e Risorse

Schede tecniche
Risorse di progettazione