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MX60LF8G18ACXKI|MACRONIX|simage
MX60LF8G18ACXKI|MACRONIX|limage
Memorie Flash

MX60LF8G18AC-XKI

NAND Flash Parallel 3.3V 8G-bit 1G x 8 25ns 63-Pin VFBGA

Macronix International Co., Ltd.
Datasheets 

Product Technical Specifications
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    3A991b.1.a.
  • Stato del componente
    Active
  • Codice HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NAND
  • Chip Density (bit)
    8G
  • Architecture
    Non Sectored
  • Boot Block
    No
  • Address Width (bit)
    30
  • Page Size
    2Kbyte
  • Number of Bits/Word (bit)
    8
  • Number of Words
    1G
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Max. Access Time (ns)
    25
  • Maximum Erase Time (s)
    0.0035/Block
  • Maximum Programming Time (ms)
    0.006/Page
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.7 to 3.6
  • Operating Current (mA)
    30
  • Program Current (mA)
    30
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    Yes
  • Support of Page Mode
    Yes
  • Minimum Endurance (Cycles)
    100000
  • Mounting
    Surface Mount
  • Package Height
    0.55(Min)
  • Package Width
    9
  • Package Length
    11
  • PCB changed
    63
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    63
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources