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IS25LP032DJTLA3|ISSI|simage
IS25LP032DJTLA3|ISSI|limage
Flash

IS25LP032D-JTLA3

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 2.5V/3V/3.3V 32M-bit 4M x 8 8ns 8-Pin USON EP Automotive AEC-Q100

Integrated Silicon Solution Inc
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Part Status
    Active
  • HTS
    8542.32.00.71
  • Automotive
    Yes
  • PPAP
    Yes
  • Cell Type
    NOR
  • Chip Density (bit)
    32M
  • Architecture
    Sectored
  • Boot Block
    Yes
  • Block Organization
    Symmetrical
  • Address Width (bit)
    24
  • Sector Size
    4Kbyte x 1024
  • Page Size
    256byte
  • Number of Bits/Word (bit)
    8
  • Number of Words
    4M
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    8
  • Maximum Erase Time (s)
    24/Chip
  • Maximum Programming Time (ms)
    0.8/Page
  • Interface Type
    Serial (SPI, Dual SPI, Quad SPI)
  • Minimum Operating Supply Voltage (V)
    2.3
  • Typical Operating Supply Voltage (V)
    2.5|3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.3 to 3.6
  • Operating Current (mA)
    25
  • Program Current (mA)
    25
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    125
  • Supplier Temperature Grade
    Automotive
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Mounting
    Surface Mount
  • Package Height
    0.53
  • Package Width
    3
  • Package Length
    4
  • PCB changed
    8
  • Standard Package Name
    SON
  • Supplier Package
    USON EP
  • Pin Count
    8

Documentation and Resources

Datasheets
Design resources