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Arrow Electronic Components Online
C1F500|BEL_FUSE|simage
C1F500|BEL_FUSE|limage
Fusibili

C1F 500

Fuse Chip Fast Acting 0.5A 125V SMD Solder Pad 1206 3.2 X 1.58 X 0.63mm Ceramic Automotive AEC-Q200

Bel
Datasheets 

Product Technical Specifications
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8536.10.00.40
  • Automotive
    Yes
  • PPAP
    Unknown
  • Type
    Chip
  • Acting
    Fast
  • Application
    LCD Monitor|Medical Equipment|Note Book|Power Supply
  • Fuse Size (mm)
    3.2 X 1.58 X 0.63
  • Current Rating (A)
    0.5
  • Maximum Voltage Rating (V)
    125
  • Maximum AC Voltage Rating (V)
    125
  • Maximum DC Voltage Rating (V)
    63
  • Maximum Power Dissipation (W)
    0.35
  • Breaking Capacity @ Rated Voltage (A)
    100@125VAC|50@63VDC
  • Typical Melting I2t (A²S)
    0.0015
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Supplier Temperature Grade
    Automotive
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.58
  • Product Length (mm)
    3.2
  • Product Height (mm)
    0.63
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    1206

Documentation and Resources

Datasheets
Design resources