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C1812C944KARLCAUTO|KEMET|simage
C1812C944KARLCAUTO|KEMET|limage
Condensatori in ceramica multitstrato

C1812C944KARLCAUTO

Cap Ceramic 0.94uF 250V X7R 10% Pad Konnekt 2 Stacked 125°C T/R Automotive AEC-Q200

KEMET Corporation
Datasheets 

KC-Link with KONNEKT Technology C0G MLCC are developed for high-efficiency, high density power applications in automotive and industrial applications. Their unique combination of KC-Link & KONNEKT technology make them ideal for space reduction in fast switching semiconductor applications.

KEMET's C0G with KONNEKT technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern. KONNEKT technology enables a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers ESR (Effective Series Resistance) and ESL (Effective Series Inductance) which increases ripple current handling capability.



Applications

  • Wide Bandgap (WBG), silicon carbinde (SiC) & gallium nitride (GaN) systems
  • Data Centers
  • EV/HEV (drive systems, charging)
  • LLC resonant converters
  • Switched tank converters
  • Wireless charging systems
  • Photovoltaic systems
  • Power converters
  • Inverters
  • DC link
  • Snubber


Benefits

  • Extremely high-power density and ripple current capability
  • Extremely low equivalent series resistance (ESR)
  • Extremely low equivalent series inductance (ESL)
  • Low-loss orientation option for higher current handling capability
  • Capacitance offerings ranging from 14-880nF
  • DC voltage ratings from 500 - 2,000 V
  • Operating temperature range of -55°C - +150°C
  • No capacitance shift with voltage
  • No piezoelectric noise
  • High thermal stability
  • Surface mountable using standard MLCC reflow profiles




Product Video

Product Technical Specifications
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8532.24.00.20
  • Automotive
    Yes
  • PPAP
    Yes
  • Capacitance Value
    0.94uF
  • Tolerance
    10%
  • Voltage
    250VDC
  • Equivalent Series Resistance Type
    Low
  • Dielectric
    X7R
  • Technology
    Standard
  • Microwave Application
    Yes
  • Construction
    Konnekt
  • Mounting
    Surface Mount
  • Termination Style
    Pad
  • Number of Terminals
    2
  • Case Style
    Ceramic Chip
  • Dissipation Factor (%)
    2.5
  • Size (mm)
    4.5 X 3.2 X 3.5
  • Package/Case
    2 Stacked
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Length (mm)
    4.5
  • Product Depth (mm)
    3.2
  • Product Height (mm)
    3.5
  • Product Weight (g)
    0.25

Documentation and Resources

Datasheets
Design resources